The consortium comprises PROSTEP as lead, the Hamburg-based companies NXP Semiconductors and consider it, 3D MicroPrint in Chemnitz, the University of Hamburg, the University of Ulm, Harburg Technical University, the Frauhofer Institute ENAS in Chemnitz and the associated partner Airbus. The aircraft manufacturer has, among other things, specified the requirements and use cases for additive manufacturing. NXP provides the secure elements for the 3D printers and the RFID chips for this application. The basic blockchain implementation is being done by the company consider it. The university partners are involved in developing the security and blockchain architecture and will work on integrating the project results into teaching in particular.